MULTILAYER SUBSTRATE, COMPONENT MOUNTING SUBSTRATE, HEAT DISSIPATION STRUCTURE AND ELECTRIC APPARATUS

• Main Author: SUGAYA HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 22.07.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To improve versatility and to improve manufacture efficiency while maintaining high heat conductivity.SOLUTION: A multilayer substrate comprises: double-layer substrates 21a-21c in each of which conductor layers 31 are formed on both surfaces of an insulation layer 32; and insulation layers 22a and 22b which are held between the double-layer substrates 21a-21c, and is configured to conduct external heat conducted from the outside to the conductor layer 31 closer to a top face 11a or internal heat generated in the conductor layer 31 closer to the top face 11a to the conductor layer 31 closer to a bottom face 11b. The insulation layer 32 and the insulation layers 22a and 22b are formed from a high-heat-conductivity material and in opposite regions Ba-Bc of the double-layer substrates 21a-21c facing a conduction region A to which the external heat is conducted or a region in which the internal heat is generated in the conductor layer 31 closer to the top face 11a, a via 33 is provided for connecting a pair of conductor layers 31 formed on both the surfaces of the double-layer substrates 21a-21c with each other.SELECTED DRAWING: Figure 3 【課題】高い熱伝導性を維持しつつ、汎用性を向上させると共に製造効率を向上させる。【解決手段】絶縁層３２の両面に導体層３１がそれぞれ形成された二層基板２１ａ〜２１ｃと、二層基板２１ａ〜２１ｃの間に挟まれた絶縁層２２ａ，２２ｂとを備えて、上面１１ａ側の導体層３１に外部から伝導した外部の熱または上面１１ａ側の導体層３１において発生した内部の熱を下面１１ｂ側の導体層３１に伝導可能に構成され、絶縁層３２および絶縁層２２ａ，２２ｂは、高熱伝導性材料でそれぞれ形成され、上面１１ａ側の導体層３１における外部の熱が伝導する伝導領域Ａまたは内部の熱を発生する領域に対向する二層基板２１ａ〜２１ｃの対向領域Ｂａ〜Ｂｃには、二層基板２１ａ〜２１ｃの両面にそれぞれ形成された一対の導体層３１同士を接続するビア３３が設けられている。【選択図】図３