PROCESSING METHOD

• Main Authors: KATORI SHIGETAKA, IGAWA TAKUTO, SHINOHE TAKASHI
• Format: Patent
• Language: English; Japanese
• Published: 22.07.2019
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To provide a new processing method capable of processing a substrate well and stably even when a material hardly atomized or hardly forming droplets is applied.SOLUTION: A processing method of a substrate includes an atomizing/droplet-forming step for producing mist or droplets 4b by atomizing or droplet-forming a raw material solution 4a containing at least a solvent and a processing agent, a transporting step for supplying a carrier gas 2a to the mist or droplets 4b and transporting the mist or droplets 4b to a substrate 10 by the carrier gas 2a, and a reaction step for subjecting the mist or droplets 4b to thermal reaction on the substrate 10. The raw material solution 4a is homogenized before the atomizing/droplet-forming step. The thermal reaction is carried out at a temperature of the boiling point of the solvent or higher.SELECTED DRAWING: Figure 1 【課題】霧化または液滴化が困難な材料を用いた場合であっても、良好且つ安定的に基体を処理することができる新規な処理方法を提供する。【解決手段】溶媒と処理剤とを少なくとも含む原料溶液４ａを霧化または液滴化してミストまたは液滴４ｂを発生させる霧化・液滴化工程と、キャリアガス２ａをミストまたは液滴４ｂに供給し、該キャリアガス２ａでもってミストまたは液滴４ｂを基体１０まで搬送する搬送工程と、ミストまたは液滴４ｂを基体１０上で熱反応させる反応工程とを含む処理方法において、前記霧化・液滴化工程の前に、原料溶液４ａにホモジナイズ処理を行い、さらに、前記熱反応を前記溶媒の沸点以上の温度で行って、基体を処理する処理方法。【選択図】図１