RESIN FILM FOR TEMPORARY FIXING, RESIN FILM SHEET FOR TEMPORARY FIXING, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

• Main Authors: OYAMA YASUYUKI, IKETANI TAKUJI, SOBUE SHOGO, YAMAGUCHI YUJI
• Format: Patent
• Language: English; Japanese
• Published: 11.07.2019
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

To provide a resin film for temporary fixing and a resin film sheet for temporary fixing which can adequately process a semiconductor wafer provided with a connection terminal or an electronic component having evenness such as an element, can be easily separated from the electronic component and a support after processing, and a method for manufacturing a semiconductor device using the resin film for temporary fixing.SOLUTION: A method for manufacturing a semiconductor device includes: a first step of preparing a resin film for temporary fixing including a first layer 41 containing a thermoplastic resin and a second layer 42 which is provided on the first layer and contains a thermoplastic resin and a curable component; and a second step of sticking surfaces provided with a semiconductor wafer or a connection terminal of an element from a first layer side. A thickness of the first layer in the resin film for temporary fixing prepared in the first step is smaller than a height T of the connection terminal, and the first layer is interposed between the second layer and the connection terminal in the resin film for temporary fixing stuck to the semiconductor wafer or the element in the second step.SELECTED DRAWING: Figure 8 【課題】接続端子が設けられた半導体ウェハ若しくは素子等の凹凸を有する電子部品の加工を良好に行うことができるとともに、加工後の電子部品及び支持体から容易に剥離が可能な仮固定用樹脂フィルム及び仮固定用樹脂フィルムシート、仮固定用樹脂フィルムを用いる半導体装置の製造方法を提供する。【解決手段】熱可塑性樹脂を含む第一の層４１と、第一の層上に設けられた、熱可塑性樹脂及び硬化性成分を含む第二の層４２とを備える仮固定用樹脂フィルムを用意する第１ステップと、半導体ウェハ若しくは素子の接続端子が設けられている面にを第一の層側から貼り合わせる第２ステップとを備える。第１ステップで用意する仮固定用樹脂フィルムにおける第一の層の厚さが、接続端子の高さＴよりも小さく、かつ、第２ステップで半導体ウェハ若しくは素子と貼り合わせた仮固定用樹脂フィルムにおいて、第二の層と接続端子との間に第一の層が介在する。【選択図】図８