CONTACT DEVICE AND ELECTROMAGNETIC RELAY
To reduce conduction failure due to freezing.SOLUTION: A contact device A1 comprises a fixed terminal 1, a movable member 11, a restricting member 12, and heat transfer structure 16. The fixed terminal 1 has a fixed contact 13. The movable member 11 has a movable contact 14, and moves between a clos...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
27.06.2019
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Subjects | |
Online Access | Get full text |
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Summary: | To reduce conduction failure due to freezing.SOLUTION: A contact device A1 comprises a fixed terminal 1, a movable member 11, a restricting member 12, and heat transfer structure 16. The fixed terminal 1 has a fixed contact 13. The movable member 11 has a movable contact 14, and moves between a closed position in which the movable contact 14 contacts the fixed contact 13 and an open position in which the movable contact 14 separates from the fixed contact 13. The restricting member 12 contacts the movable contact 14 when the movable member 11 is in the open position. The heat transfer structure 16 transfers the heat from the movable contact 14 when the movable member 11 is in the open position to the fixed terminal 1 through a thermal path including at least the restricting member 12.SELECTED DRAWING: Figure 1
【課題】凍結による接点の導通不良を低減する。【解決手段】接点装置A1は、固定端子1と、可動部材11と、規制部材12と、熱伝達構造16と、を備える。固定端子1は、固定接点13を有する。可動部材11は、可動接点14を有し、可動接点14が固定接点13に接触する閉位置と可動接点14が固定接点13から離れる開位置との間で移動する。規制部材12は、可動部材11が開位置にあるときに可動接点14に接触する。熱伝達構造16は、少なくとも規制部材12を含む熱経路を通して、可動部材11が開位置にあるときの可動接点14からの熱を固定端子1に伝達する。【選択図】図1 |
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Bibliography: | Application Number: JP20170238044 |