INTERFACE UNIT AND SEMICONDUCTOR DEVICE
To provide an interface unit which can select the presence/absence of loading of a sensor with less space, and a semiconductor device using the interface unit.SOLUTION: An interface unit includes: a plate-like bus bar that forms an ohmic type cross-sectional shape that sandwiches an U-shaped portion...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
24.06.2019
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Subjects | |
Online Access | Get full text |
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Summary: | To provide an interface unit which can select the presence/absence of loading of a sensor with less space, and a semiconductor device using the interface unit.SOLUTION: An interface unit includes: a plate-like bus bar that forms an ohmic type cross-sectional shape that sandwiches an U-shaped portion specified by opposite first and second erected portions 37d1 and 37d2 in its center and of which both ends connected to the U-shaped portion extend in an opposite direction on the same plane, of which each flat surface portion on both ends are used as bus bar connection parts connected to a semiconductor unit; and a support part 30b that seals the inside of the first and second erected portions with a resin, has a rectangular parallelepiped portion of which two surfaces parallel to the first and second erected portions are used as side surfaces, has a cavity part 40b for sensor provided in the resin along the first erected portion of the rectangular parallelepiped portion, and has a groove part 50 provided on one bottom surface side of the rectangular parallelepiped portion on a side close to the bus bar connection part.SELECTED DRAWING: Figure 5
【課題】省スペースでセンサの搭載の有無を選択可能なインターフェースユニット及びこのインターフェースユニットを用いた半導体装置を提供する。【解決手段】インターフェースユニットは、対向する第1及び第2の立上部分37d1、37d2によって規定されるU字部分を中央に挟み、該U字部分に接続された両端が同一平面上を反対方向に延在するオーム型の断面形状をなし、両端の平面部分のそれぞれを、半導体ユニットに接続されるバスバー接続部とする板状のバスバーと、第1及び第2の立上部分を内部に樹脂で封止し、第1及び第2の立上部分に平行な2面をそれぞれ側面とした直方体部分を有し、該直方体部分の第1の立上部分に沿って樹脂中にセンサ用空洞部40bを設け、バスバー接続部に近い側の直方体部分の一方の底面側に、溝部50を設けた支持部30bと、を備える。【選択図】図5 |
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Bibliography: | Application Number: JP20170230885 |