PRINTED CIRCUIT BOARD

• Main Authors: KIM KI SEOK, YOO GAYOUNG, CHOI YULIM, SHIM JI HYE, KIM SONG I, PARK CHANGHWA
• Format: Patent
• Language: English; Japanese
• Published: 06.06.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a printed circuit board that reduces signal loss that occurs when a high frequency signal is transmitted.SOLUTION: A printed circuit board includes an insulating layer 100 in which a first circuit 110 is embedded on the lower surface, a first adhesive layer 120 interposed between the insulating layer and the first circuit, and a second adhesive layer 130 formed on the upper surface of the insulating layer. The dielectric loss of the second adhesive layer is smaller than the dielectric loss of the insulating layer, and the roughness of the top surface of the first circuit is smaller than 0.1 μm.SELECTED DRAWING: Figure 1a 【課題】高周波信号の伝送時に発生する信号損失を低減するプリント回路基板を提供する。【解決手段】プリント回路基板は、下面に第１回路１１０が埋め込まれた絶縁層１００と、絶縁層と第１回路との間に介在された第１接着層１２０と、絶縁層の上面に形成された第２接着層１３０と、を含む。第２接着層の誘電損失は、絶縁層の誘電損失よりも小さく、第１回路の上面の粗さは０．１μｍより小さい。【選択図】図１ａ