SILVER PASTE, JOINED BODY, AND METHOD FOR MANUFACTURING JOINED BODY

To provide silver paste that enables formation of a joined layer by heating at a lower temperature than conventional one, in which the joined layer formed by heating prevents lowering of a bond strength and has high reliability even when a cold-heat cycle at a temperature comparable to conventional...

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Bibliographic Details
Main Authors NUMA TATSUYA, ISHIKAWA MASAYUKI
Format Patent
LanguageEnglish
Japanese
Published 06.06.2019
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CASTING
CONDUCTORS
ELECTRICITY
INSULATORS
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
PERFORMING OPERATIONS
POWDER METALLURGY
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
TRANSPORTING
WORKING METALLIC POWDER
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Summary:To provide silver paste that enables formation of a joined layer by heating at a lower temperature than conventional one, in which the joined layer formed by heating prevents lowering of a bond strength and has high reliability even when a cold-heat cycle at a temperature comparable to conventional level or higher temperature is loaded.SOLUTION: Silver paste contains silver powder, a thermosetting resin composition, a dispersant and an organic solvent, in which the solver powder has a specific particle size distribution, 0.1 pts.mass or more of the dispersant is contained in 100 pts.mass of the total amount of the silver paste, 0.5 pts.mass or more and 20 pts.mass or less of the thermosetting resin composition is contained in 100 pts.mass of the total content of the silver paste, and the thermosetting resin composition contains at least one composition selected from the group consisting of an epoxy thermosetting resin composition, an acrylic thermosetting resin composition and a silicone thermosetting resin composition.SELECTED DRAWING: None 【課題】従来よりも低温度での加熱によって接合層を形成することができ、その加熱によって形成された接合層は、従来と同程度、もしくはより高温度に達する冷熱サイクルを負荷した場合であっても接合強度が低下しにくく、信頼性が高い銀ペーストを提供する。【解決手段】銀粉末と、熱硬化性樹脂組成物と、分散剤と、有機溶媒とを含む銀ペーストであって、銀粉末は、特定の粒度分布を有し、前記分散剤を、銀ペーストの全体量１００質量部に対して０．１質量部以上含み、前記熱硬化性樹脂組成物を、銀ペーストの全体量１００質量部に対して０．５質量部以上２０質量部以下の範囲で含有し、前記熱硬化性樹脂組成物は、エポキシ系熱硬化性樹脂組成物、アクリル系熱硬化性樹脂組成物、及びシリコーン系熱硬化性樹脂組成物からなる群より選ばれる少なくとも１種の組成物を含む銀ペースト。【選択図】なし
Bibliography:Application Number: JP20170214501