SEALING SHEET WITH SEPARATOR, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

To provide a sealing sheet with a separator that can improve the appearance of a manufactured semiconductor device.SOLUTION: A sealing sheet with a separator includes a separator and a sealing sheet laminated on the separator. The separator is a polyethylene terephthalate film, a polyethylene film,...

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Bibliographic Details
Main Authors SHIGA GOSHI, IINO CHIE
Format Patent
LanguageEnglish
Japanese
Published 30.05.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a sealing sheet with a separator that can improve the appearance of a manufactured semiconductor device.SOLUTION: A sealing sheet with a separator includes a separator and a sealing sheet laminated on the separator. The separator is a polyethylene terephthalate film, a polyethylene film, or a polypropylene film, and a surface of the separator in contact with the sealing sheet is treated with an amino alkyd release agent, and the peeling strength between the sealing sheet and the separator after heating at 150°C for one hour is less than 0.4 N/100 mm width.SELECTED DRAWING: Figure 1 【課題】 製造される半導体装置の外観を良好とすることが可能なセパレータ付き封止用シートを提供すること。【解決手段】 セパレータと、セパレータ上に積層された封止用シートとを備え、セパレータは、ポリエチレンテレフタレートフィルム、ポリエチレンフィルム、又は、ポリプロピレンフィルムであり、セパレータは、封止用シートと接する面がアミノアルキド系離型剤で処理されており、１５０℃で１時間加熱後の封止用シートとセパレータとの剥離強度が０．４Ｎ／１００ｍｍ幅未満であるセパレータ付き封止用シート。【選択図】 図１
Bibliography:Application Number: JP20190032951