HARD ROLLED COPPER FOIL AND MANUFACTURING METHOD OF HARD ROLLED COPPER FOIL

• Main Authors: FUKUDA ERI, MORIOKA NOBUAKI, SAKAI YUTA
• Format: Patent
• Language: English; Japanese
• Published: 16.05.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; TREATMENT OF ALLOYS OR NON-FERROUS METALS

To provide a hard rolled copper foil exhibiting excellent bending resistance when heated and layered to an insulation resin substrate without increasing final draft, and suitably being used for a flexible printed wiring board excellent in high speed transmission property capable of maintaining a surface roughness low since rolling marks are hardly generated, and hardly generating ordinary temperature softening and excellent in working efficiency or foilability when processed to the flexible printed wiring board after storage.SOLUTION: There is provided a hard rolled copper foil having crystal orientation density in a Copper orientation of 10 or more and crystal orientation density in a Brass direction of 20 or more.SELECTED DRAWING: None 【課題】最終圧下率を高く上げなくても、絶縁性樹脂基材に加熱して積層すれば、優れた耐折り曲げ特性を発現し、また、圧延痕が生じ難いから表面粗さを低く維持できるため高速伝送特性に優れたフレキシブルプリント配線板に好適に使用できる硬質圧延銅箔であって、しかも、常温軟化し難く、保管後にフレキシブルプリント配線板に加工する際の作業効率や通箔性が優れる硬質圧延銅箔を提供する。【解決手段】Copper方位の結晶方位密度が10以上、且つ、Brass方位の結晶方位密度が20以上である硬質圧延銅箔。【選択図】なし