SILICON-CONTAINING UNDERLAYERS

• Main Authors: SUZANNE M COLEY, PAUL J LABEAUME, YAMADA SHINTARO, CHARLOTTE A CUTLER, OWENDI ONGAYI, LI MINGQI, JAMES F CAMERON, LI CUI, CHRISTOPHER P SULLIVAN
• Format: Patent
• Language: English; Japanese
• Published: 16.05.2019
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide wet-strippable silicon-containing underlayers.SOLUTION: Wet-strippable underlayer compositions comprise one or more silicon-containing polymers comprising a backbone comprising Si-O linkages, one or more organic blend polymers, and a cure catalyst. These compositions are useful in the manufacture of various electronic devices.SELECTED DRAWING: None 【課題】湿式剥離性シリコン含有下層を提供する。【解決手段】Ｓｉ−Ｏ結合を含む骨格を含む１つ以上のシリコン含有ポリマーと、１つ以上の有機ブレンドポリマーと、硬化触媒とを含む湿式剥離性下層組成物が提供される。これらの組成物は、様々な電子デバイスの製造において有用である。【選択図】なし