COATED FILM FORMING DEVICE AND SYSTEM OF MANUFACTURING SEMICONDUCTOR DEVICE

• Main Authors: ENOMOTO MASASHI, SHIMURA SATORU
• Format: Patent
• Language: English; Japanese
• Published: 25.04.2019
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

To form a pattern with high uniformity inside a surface of a substrate including an end of the substrate.SOLUTION: A coated film forming device comprises a plurality of processing modules including: a coating module 3B for an undercoated film for forming the undercoated film by coating a substrate W with a material of the undercoated film; a coating module for a resist for forming a resist film by coating the substrate W formed with the undercoated film, with a resist; and a heating module 25 that performs a heating processing on a coated film formed on the substrate W. The coated film forming device further comprises; a substrate transfer mechanism F1 that transfers the substrate between the plurality of processing modules; an end shape measurement part that measures an end shape being a radial direction-shape of an end front surface of the substrate W with warpage of the substrate W included; and an execution part 60 that executes the processing such as adjustment of a coating recipe on the basis of information of the warpage of the substrate W with respect to a horizontal surface and the end shape acquired in the end shape measurement part.SELECTED DRAWING: Figure 7 【課題】基板の端部を含む当該基板の面内において均一性高い形状でパターンを形成すること。【解決手段】基板Ｗに下地膜の材料を塗布して下地膜を形成するための下地膜用の塗布モジュール３Ｂと、下地膜が形成された基板Ｗにレジストを塗布してレジスト膜を形成するためのレジスト用塗布モジュールと、基板Ｗ上に形成された塗布膜に対して加熱処理する加熱モジュール２５と、を含む複数の処理モジュールと、複数の処理モジュールの間で基板を搬送する基板搬送機構Ｆ１と、基板Ｗの反りを含んだ状態で、基板Ｗの端部表面の径方向の形状である端部形状を測定する端部形状測定部と、水平な面に対する基板Ｗの反りの情報と前記端部形状測定部にて取得した端部形状とに基づいて例えば塗布レシピの調整などの処理を実行する実行部６０と、を備えるように装置を構成する。【選択図】図７