SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

• Main Authors: KUBO TOMOYA, FUKASE KATSUYA, MIZUNO SHIGERU
• Format: Patent
• Language: English; Japanese
• Published: 25.04.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a substrate with a built-in electronic component having a novel structure comprising an electronic component embedded in an insulating layer and enabling heat generated from the electronic component to be sufficiently dissipated.SOLUTION: The substrate with a built-in electronic component substrate includes: a first insulating layer 24; a metal layer M formed on the first insulating layer 24; a heat generating first electronic component 30 disposed on the metal layer M; second insulating layers 25, 26 which are formed on the first insulating layer 24 and the metal layer M and in each of which the first electronic component 30 is embedded; an opening 39 formed in the second insulating layers 25, 26 and exposing a part of the metal layer M; a second electronic component 40 disposed above the second insulating layers 25, 26; and a heat dissipation member 50 connected to the metal layer M in the opening 39 and connected to an upper surface of the second electronic component 40.SELECTED DRAWING: Figure 25 【課題】絶縁層に埋め込まれた電子部品から発する熱を十分に放熱できる新規な構造の電子部品内蔵基板を提供する。【解決手段】第１絶縁層２４と、第１絶縁層２４の上に形成された金属層Ｍと、金属層Ｍの上に配置された発熱する第１電子部品３０と、第１絶縁層２４及び金属層Ｍの上に形成され、第１電子部品３０を埋め込む第２絶縁層２５，２６と、第２絶縁層２５，２６に形成され、金属層Ｍの一部を露出させる開口部３９と、第２絶縁層２５，２６の上方に配置された第２電子部品４０と、開口部３９内の金属層Ｍに接続され、かつ、第２電子部品４０の上面に接続された放熱部材５０とを含む。【選択図】図２５