IMAGE SENSOR, MANUFACTURING METHOD OF IMAGE SENSOR, AND ELECTRONIC DEVICE

• Main Authors: TAKIMOTO KAORI, OOKA YUTAKA, YAMAMOTO ATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 25.04.2019
• Subjects: ACCESSORIES THEREFOR; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES; APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHOTOGRAPHY; PHYSICS; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

To control lens installation height with high precision.SOLUTION: An image sensor includes a laminated lens structure in which lens-equipped substrates in which lenses are arranged inside through holes formed on a substrate are directly bonded to each other and the plurality of lenses are laminated in the optical axis direction, an imaging unit that photoelectrically converts incident light collected by the plurality of lenses of the laminated lens structure, a protection substrate that protects the imaging unit, and a spacer disposed between the protection substrate and the laminated lens structure. The present technology can be applied to, for example, a camera module and the like.SELECTED DRAWING: Figure 143 【課題】レンズ設置高さを高精度に制御する。【解決手段】撮像素子は、基板に形成された貫通孔の内側にレンズが配置されたレンズ付き基板どうしが直接接合により貼り合わされて複数枚のレンズが光軸方向に積層された積層レンズ構造体と、積層レンズ構造体の複数枚のレンズにより集光された入射光を光電変換する撮像部と、撮像部を保護する保護基板と、保護基板と積層レンズ構造体との間に配置されたスペーサとを備える。本技術は、例えば、カメラモジュール等に適用できる。【選択図】図１４３