METHOD FOR MANUFACTURING PRINTED WIRING BOARD

• Main Author: SANO KATSUYUKI
• Format: Patent
• Language: English; Japanese
• Published: 25.04.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To improve connection quality of a printed wiring board to an external wiring board.SOLUTION: A method of the present invention includes steps of: forming a laminate 10 having a second surface 10S as a connection surface to an external wiring board and a first surface 10F as a mounting surface for a...