ADHESIVE SHEET FOR HEAT RELEASE, LAMINATE FOR HEAL RELEASE ADHESIVE MEMBER, AND COMPOSITE MEMBER

• Main Authors: ANDO KENJI, SAWAGUCHI JUICHI, SAKAGUCHI KAORI, KOBAYASHI HIDENORI, HAYASAKA TSUTOMU
• Format: Patent
• Language: English; Japanese
• Published: 25.04.2019
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES; WORKING-UP

To provide an adhesive sheet for heat release high in heat release property and excellent in durability to heat fatigue, especially an adhesive sheet for heat release good in yield of a manufacturing process of a power semiconductor, and suitable for the powder semiconductor.SOLUTION: It is solved by an adhesive sheet for heat release containing a thermosetting resin (A) and a dendrite-like metal fine particle (B). It is also solved by a laminate for heat release adhesive member arranged between a heat release base substrate and a heat generator containing a member capable of generating heat, and having the adhesive sheet for heat release adhering to at least one of the heat release base substrate and the heat generator capable of generating heat, and insulation layer, in which the adhesive sheet for heat release contains the thermosetting resin (A) and the dendrite-like metal fine particle (B).SELECTED DRAWING: Figure 2 【課題】本発明は、放熱性が高く、熱疲労に対する耐久性に優れる放熱用接着シートであって、なかでもパワー半導体装置の製造工程の歩留まりが良好であり、パワー半導体装置に好適な放熱用接着シートを提供することを目的とする。【解決手段】熱硬化性樹脂（Ａ）と、デンドライト状金属微粒子（Ｂ）とを含む放熱用接着シートにより解決される。また、放熱ベース基板と、熱を発生し得る部材を含む発熱体との間に配置される放熱接着部材用積層体であって、前記放熱ベース基板および熱を発生し得る部材を含む発熱体の少なくともいずれかと接着する放熱用接着シートと、絶縁層とを有しており、前記放熱用接着シートは、熱硬化性樹脂（Ａ）と、デンドライト状金属微粒子（Ｂ）とを含む、放熱接着部材用積層体により解決される。【選択図】図２