COIL ELECTRONIC COMPONENT

To provide a coil electronic component that eliminates uneven plating of multiple coil patterns.SOLUTION: In a coil electronic component 100, an internal coil 12 including an upper coil 121 and a lower coil 122 formed by a coil pattern includes a via 1212 for electrically connecting the upper coil a...

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Bibliographic Details
Main Authors PARK KWANG IL, KIM YOUNG SUN, CHA HYE YEON
Format Patent
LanguageEnglish
Japanese
Published 18.04.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
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Summary:To provide a coil electronic component that eliminates uneven plating of multiple coil patterns.SOLUTION: In a coil electronic component 100, an internal coil 12 including an upper coil 121 and a lower coil 122 formed by a coil pattern includes a via 1212 for electrically connecting the upper coil and the lower coil. The via 1212 is formed along at least a part of a boundary surface HS of a through hole H penetrating the upper surface and the lower surface of a support member 13 supporting the upper coil and the lower coil.SELECTED DRAWING: Figure 1 【課題】複数のコイルパターンのめっきの不均一を解消したコイル電子部品を提供する。【解決手段】コイル電子部品１００において、コイルパターンにより形成された上部コイル１２１及び下部コイル１２２を含む内部コイル１２は、上部コイルと下部コイルとを電気的に接続するためのビア１２１２を含む。ビア１２１２は、上部コイル及び下部コイルを支持する支持部材１３の上面及び下面を貫通する貫通孔Ｈの境界面ＨＳの少なくとも一部に沿って形成される。【選択図】図１
Bibliography:Application Number: JP20180127295