SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND STORAGE MEDIUM

• Main Authors: TANAKA KOICHIRO, FUKUDA MASAHIRO, ICHINOMIYA HIROSHI, KAI AKIKO
• Format: Patent
• Language: English; Japanese
• Published: 18.04.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a substrate processing method and the like which inhibits scattering of a cleaning liquid while ensuring supply of the cleaning liquid on a surface of a substrate to remove the cleaning liquid.SOLUTION: In a substrate processing method, the step of supplying a cleaning liquid to remove a processing liquid after performing a liquid treatment of a rotating substrate W includes a discharge position movement step of moving from a central part side toward a peripheral part side of the substrate, a cleaning liquid nozzle 421 of discharging the cleaning liquid toward downstream side of the rotation direction of the substrate W and obliquely with respect to a surface of the substrate W, and a gas nozzle 411 for discharging a gas toward a position adjacent to the central part side of the substrate W when viewed from a droplet landing position R of the cleaning liquid. At this time, the rotation number of the substrate W is changed in such a manner that the rotation number during a period where the droplet landing position R moves in a second region on the peripheral part side is smaller than the maximum rotation number during a period where the droplet landing position R moves in a first region on the central part side.SELECTED DRAWING: Figure 7 【課題】基板の表面に洗浄液を確実に供給しつつ、洗浄液の飛散を抑えて処理液の除去を行うことが可能な基板処理方法などを提供する。【解決手段】回転する基板Ｗの液処理を行った後、洗浄液を供給して処理液を除去するにあたり、吐出位置移動工程では、基板Ｗの回転方向の下流側へ向けて、基板Ｗの表面に対して斜めに洗浄液を吐出する洗浄液ノズル４２１と、洗浄液の着液位置Ｒから見て、基板Ｗの中央部側に隣接する位置に向けてガスを吐出するガスノズル４１１とを、基板の中央部側から周縁部側へ向けて移動させる。このとき、着液位置Ｒが周縁部側の第２領域を移動している期間中の回転数が、中央部側の第１領域を移動している期間中の最大の回転数よりも小さくなるように基板Ｗの回転数を変化させる。【選択図】図７