METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE

• Main Author: HIRAO TAKESHI
• Format: Patent
• Language: English; Japanese
• Published: 11.04.2019
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

To achieve both avoiding damage of a guide pin provided on a mold and suppressing increase of defect rate.SOLUTION: A method for manufacturing a light-emitting device includes the steps of: (A) for disposing a first mold 200A and a second mold 200B so as to oppose each other, the first mold having a frame 210 provided with at least a plurality of holes 212, and the second mold having one or more guide pins 202 each of which opposes one of the holes; (B) for disposing a substrate between the first mold and the second mold; and (C) for obtaining a composite substrate 120A by filling a cavity defined by the first mold and the second mold, with a first resin composition 170r and consolidating the first resin composition. The step (C) includes a step for combining the first mold and the second mold such that the respective guide pins are inserted into the corresponding holes. Openings of one or more of the holes 212y at positions which the guide pins do not oppose are plugged by a second resin composition 214.SELECTED DRAWING: Figure 4 【課題】金型に設けたガイドピンの損傷の回避と、不良品率の上昇の抑制とを両立させる。【解決手段】発光装置の製造方法は、少なくとも、複数の穴部２１２が設けられた枠部２１０を有する第１金型２００Ａと、各々が穴部のうちの１つに対向する１以上のガイドピン２０２を有する第２金型２００Ｂとを対向させて配置する工程（Ａ）と、第１金型と第２金型との間に基板を配置する工程（Ｂ）と、第１金型および第２金型によって規定されるキャビティを第１樹脂組成物１７０ｒで充填して第１樹脂組成物を硬化させることにより、複合基板１２０Ａを得る工程（Ｃ）とを含む。工程（Ｃ）は、対応する穴部に各ガイドピンが挿入されるように第１金型と第２金型とを結合する工程を含み、ガイドピンが対向しない位置にある１以上の穴部２１２ｙの開口は、第２樹脂組成物２１４によって塞がれている。【選択図】図４