MANUFACTURING METHOD OF STRUCTURE AND STRUCTURE

• Main Author: OZAWA YUTAKA
• Format: Patent
• Language: English; Japanese
• Published: 11.04.2019
• Subjects: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TRANSPORTING

To provide a manufacturing method of a structure and the structure capable of facilitating handling, by restraining a variation in the structure.SOLUTION: A manufacturing method of a structure joins a first substrate 100 having a first surface 102 and a second surface 104 opposed to the first surface and a second substrate having a third surface and arranging a conductive layer 300 for conducting an area of a part inside of a prescribed first area 110 and the outside on the third surface by contacting the second surface and the third surface on the inside of a first area, and the first substrate is formed with a plurality of recessed parts 120 for respectively exposing the conductive layer to one surface side by juxtaposing in the prescribed direction in the first area when viewed from the vertical direction to the first surface.SELECTED DRAWING: Figure 11 【課題】構造のばらつきを抑えるとともに、取り扱いを容易にすることを可能にした構造体の製造方法、および構造体を提供する。【解決手段】構造体の製造方法は、第１面１０２と第１面に対向する第２面１０４とを有する第１基板１００と、第３面を有し、所定の第１領域１１０の内側の一部の領域と外側とを導通させる導電層３００が第３面に配置された第２基板とを、第１領域の内側で第２面と第３面とを接触させて接合し、第１基板に、第１面に垂直な方向から見て前記第１領域において所定の方向に並び、かつ各々が第１面側に導電層を露出させる複数の凹部１２０を形成する。【選択図】図１１