LASER PROCESSING METHOD

To provide a laser processing method that increases processing efficiency.SOLUTION: In a laser processing method according to an embodiment, a first laser beam having a first pulse width greater than 10 ns is applied to a base plate to be processed, and a second laser beam having a second pulse widt...

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Bibliographic Details
Main Author MATSUO MIE
Format Patent
LanguageEnglish
Japanese
Published 11.04.2019
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:To provide a laser processing method that increases processing efficiency.SOLUTION: In a laser processing method according to an embodiment, a first laser beam having a first pulse width greater than 10 ns is applied to a base plate to be processed, and a second laser beam having a second pulse width smaller than the first pulse width is applied to the base plate to be processed.SELECTED DRAWING: Figure 1 【課題】加工効率の向上したレーザー加工方法を提供する。【解決手段】実施形態のレーザー加工方法は、被加工基板に、１０ナノ秒よりも長い第１のパルス幅を有する第１のレーザー光を照射し、被加工基板に、第１のパルス幅よりも短い第２のパルス幅を有する第２のレーザー光を照射する。【選択図】図１
Bibliography:Application Number: JP20170181998