PRESSURE TEMPERATURE SENSOR

• Main Authors: AOKI FUMIAKI, OGINO KAZUMASA, ONO KAZUYUKI, YOSHIDA SHUNTARO
• Format: Patent
• Language: English; Japanese
• Published: 04.04.2019
• Subjects: MEASURING; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE; MEASURING QUANTITY OF HEAT; MEASURING TEMPERATURE; PHYSICS; TESTING; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR

To provide a pressure temperature sensor which can detect both pressure and temperature and combines pressure measurement accuracy with temperature responsiveness, the pressure temperature sensor comprising a sensor chip constituted as a wafer-level package.SOLUTION: A portion of side surface of a molded resin part 140 forms an outer circumferential surface 145 which is shaped into columnar side surface. A pressure introduction hole 114 of a housing 110 includes an inner circumferential surface 117, the diameter of which is suitable for the outer circumferential surface 145 of the molded resin part 140 to fit in. The housing 110 and a molding resin part 120 hold the molded resin part 140 while the outer circumferential surface 145 of the molded resin part 140 is fitted into the inner circumferential surface 117 of the pressure introduction hole 114 and while the pressure detection and temperature detection parts of a sensor chip 150 are positioned at a tip part 116 of the pressure introduction hole 114.SELECTED DRAWING: Figure 1 【課題】圧力及び温度の両方が検出可能であると共にウェハレベルパッケージとして構成されたセンサチップを備えた圧力温度センサにおいて、圧力測定精度と温度応答性とを両立させること。【解決手段】モールド樹脂部１４０は、側面の一部が円柱側面状の外周側面１４５を有している。ハウジング１１０の圧力導入孔１１４は、モールド樹脂部１４０の外周側面１４５が嵌合する径に形成された内周側面１１７を有している。そして、ハウジング１１０及び成形樹脂部１２０は、モールド樹脂部１４０の外周側面１４５が圧力導入孔１１４の内周側面１１７に嵌合する共に、センサチップ１５０の圧力検出部及び温度検出部が圧力導入孔１１４のうち先端部１１６に位置する状態で、モールド樹脂部１４０を保持している。【選択図】図１