WOUND LAMINATE

• Main Authors: SHINODA TOMOTAKA, NISHIMURA ISAO, FUJITOMI SHINTARO, KADOTA TOSHIAKI, MIYAKI NOBUYUKI
• Format: Patent
• Language: English; Japanese
• Published: 04.04.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONVEYING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PACKING; PERFORMING OPERATIONS; PRINTED CIRCUITS; STORING; TRANSPORTING

To provide a wound laminate that can prevent curling of a high-frequency circuit laminate even when it is stored by wound on a core, where the high-frequency circuit laminate can reduce transmission loss of a high-frequency signal.SOLUTION: A wound laminate according to the present invention is characterized in that a high-frequency circuit laminate having a structure in which a resin layer, whose dielectric loss tangent is 0.001-0.01 at a frequency of 10 GHz at 23°C, and a metal layer are laminated in contact with each other, is wound on a core of 10-100 mm in radius.SELECTED DRAWING: Figure 1 【課題】高周波信号の伝送損失を低減することが可能な高周波回路用積層体を巻芯に捲回して保管した場合であっても巻癖を抑制できる積層体捲回体を提供する。【解決手段】本発明に係る積層体捲回体は、２３℃において周波数１０ＧＨｚにおける誘電正接が０．００１〜０．０１である樹脂層と、金属層とが接して積層された構造を含む高周波回路用積層体が、半径１０〜１００ｍｍの巻芯に捲回されていることを特徴とする。【選択図】図１