SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND COMPUTER STORAGE MEDIUM

• Main Author: UCHIDA JUNICHI
• Format: Patent
• Language: English; Japanese
• Published: 28.03.2019
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPARATUS SPECIALLY ADAPTED THEREFOR; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

To properly perform substrate processing using a processing liquid in accordance with the warpage of a substrate.SOLUTION: A development processor 30 includes: a spin chuck 300 for holding a wafer W; a development liquid nozzle 320 for supplying a development liquid to the surface of the wafer W held by the spin chuck 300; a ring member 382 provided annularly on the rear face side of the wafer W and having a diameter smaller than that of the wafer W; a lifting/lowering unit 383 for lifting and lowering the ring member 382; a warpage measurement unit 340 for measuring a warpage of the wafer W; and a control unit for controlling the lifting/lowering unit 383 so as to make a space between the rear face of the wafer W and the ring member 382 a prescribed distance on the basis of the warpage information measured by the warpage measurement unit 340.SELECTED DRAWING: Figure 4 【課題】基板の反りに応じて、処理液を用いた基板処理を適切に行う。【解決手段】現像処理装置３０は、ウェハＷを保持するスピンチャック３００と、スピンチャック３００に保持されたウェハＷの表面に現像液を供給する現像液ノズル３２０と、ウェハＷの裏面側に環状に設けられ、ウェハＷより小さい径を有するリング部材３８２と、リング部材３８２を昇降させる昇降部３８３と、ウェハＷの反りを計測する反り計測部３４０と、反り計測部３４０により計測された反り情報に基づいて、ウェハＷの裏面とリング部材３８２との間が所定距離になるように昇降部３８３を制御する制御部と、を備える。【選択図】図４