DETECTOR PACK, X-RAY DETECTOR, X-RAY CT DEVICE, AND MANUFACTURING METHOD OF DETECTOR PACK

• Main Authors: ASAGIRI SATOSHI, TANABE SHIGETOSHI, TOGASAKI TAKASHI
• Format: Patent
• Language: English; Japanese
• Published: 28.03.2019
• Subjects: DIAGNOSIS; HUMAN NECESSITIES; HYGIENE; IDENTIFICATION; MEASUREMENT OF NUCLEAR OR X-RADIATION; MEASURING; MEDICAL OR VETERINARY SCIENCE; PHYSICS; SURGERY; TESTING

To improve the performance and reliability of a detector in a simple manufacturing process.SOLUTION: A detector pack of the embodiment comprises a substrate, a semiconductor chip array, a scintillator array, and an adhesive member. The semiconductor chip array, which comprises a plurality of semiconductor chips for converting light to an electric signal, is electrically connected to a first surface of the substrate. The scintillator, which comprises a plurality of scintillator crystals for converting X-ray to the light, is mounted on the semiconductor chip array. The adhesive member is filled in between the semiconductor chip array and the first surface of the substrate, and in the end part of the semiconductor chip array in the longitudinal direction in order to adhere the semiconductor chip array and the substrate.SELECTED DRAWING: Figure 3 【課題】簡易な製造プロセスで、検出器の性能かつ信頼性を向上させることができる。【解決手段】本実施形態に係る検出器パックは、基板と、半導体チップアレイと、シンチレータアレイと、接着部材とを含む。半導体チップアレイは、光を電気信号に変換する複数の半導体チップから成り、前記基板の第１の面と電気的に接続される。シンチレータは、Ｘ線を前記光に変換する複数のシンチレータ結晶から成り、前記半導体チップアレイ上に設けられる。接着部材は、前記半導体チップアレイと前記基板の前記第１の面との間かつ前記半導体チップアレイの長手方向の端部に充填され、前記半導体チップアレイと前記基板とを接着する。【選択図】図３