ELECTRONIC COMPONENT

• Main Authors: KURIHARA TOMOYUKI, KAKITA NAOKI
• Format: Patent
• Language: English; Japanese
• Published: 22.03.2019
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS; SEMICONDUCTOR DEVICES

To restrain deterioration of piezoelectric substrate.SOLUTION: An electronic component includes a support substrate 10a, a piezoelectric substrate bonded onto the support substrate, a functional device 12 provided on the piezoelectric substrate, a first metal layer provided on the support substrate so as to surround the functional device, and having a lateral face in contact with the piezoelectric substrate, a second metal layer 34 provided on the piezoelectric substrate and the first metal layer, so as to overlap a boundary surface 74 where the piezoelectric substrate and the first metal layer come into contact in the plan view, a protection film 35 provided between the piezoelectric substrate and the first and second metal layers, so as to overlap at least a part of the lateral face 76 of the second metal layer on the functional device side, and at least a part of the interface in the plan view, and a cover member provided to be bonded to the second metal layer and to seal the functional device in a cavity.SELECTED DRAWING: Figure 7 【課題】圧電基板の劣化を抑制すること。【解決手段】支持基板１０ａと、前記支持基板上に接合された圧電基板と、前記圧電基板上に設けられた機能素子１２と、前記支持基板上に前記機能素子を囲むように設けられ、側面が前記圧電基板の側面と接する第１金属層と、前記圧電基板および前記第１金属層上に、平面視において前記圧電基板と前記第１金属層とが接する界面７４と重なるように設けられた第２金属層３４と、前記圧電基板および前記第１金属層と前記第２金属層との間に、平面視において前記第２金属層の前記機能素子側の側面７６の少なくとも一部および前記界面の少なくとも一部と重なるように設けられた保護膜３５と、前記第２金属層と接合し、前記機能素子を空隙に封止するように設けられたカバー部材と、を備える電子部品。【選択図】図７