SUBSTRATE HOLDING DEVICE

• Main Authors: MURAMOTO RYO, NAKAZAWA KAZUHIKO
• Format: Patent
• Language: English; Japanese
• Published: 22.03.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a substrate holding device capable of reducing the amount of processing solution flowing downward through a through hole through which a pin penetrates.SOLUTION: A substrate holding device 1 is used for a substrate processing apparatus for supplying processing liquid to a plate W. The substrate holding device 1 includes a base material member 10 and a plurality of pins 20. The base material member 10 has an upper surface 10a opposite to the back surface of the substrate W. The base material member 10 is formed with a plurality of pin through holes 12 extending in the vertical direction and opening at the upper surface 10a. The plurality of pins 20 pass through the base material member 10 in the vertical direction through the plurality of pin through holes 12 and project from the upper surface 10a to abut on the substrate W. On the side surface 10b of the base material member 10, a plurality of drainage ports 14a respectively communicating with the plurality of pin through holes 12 are formed.SELECTED DRAWING: Figure 2 【課題】ピンが貫通する貫通孔を介して下側へ流出する処理液を低減できる基板保持装置を提供する。【解決手段】基板保持装置１は、基板Ｗに処理液を供給する基板処理装置に用いられる。基板保持装置１は基体部材１０と複数のピン２０とを備えている。基体部材１０は基板Ｗの裏面と対向する上面１０ａを有しており、この基体部材１０には、鉛直方向に延びて上面１０ａにおいて開口する複数のピン用貫通孔１２が形成されている。複数のピン２０は複数のピン用貫通孔１２を介して基体部材１０を鉛直方向に貫通し、上面１０ａから突出して基板Ｗに当接する。基体部材１０の側面１０ｂには、複数のピン用貫通孔１２にそれぞれ連通する複数の排液口１４ａが形成されている。【選択図】図２