RESIN COMPOSITION AND MOLDED PRODUCT THEREOF

• Main Authors: MAJIMA YUKI, TAKAHASHI ATSUSHI, FUKUHARA KOICHIRO
• Format: Patent
• Language: English; Japanese
• Published: 22.03.2019
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a resin composition capable of forming a molded product having good thermal conductivity and mold processability and having good mechanical strength and to provide a molded product.SOLUTION: The resin composition includes (A) a polyamide resin, (B) a maleic anhydride-modified product of ethylene-octene copolymer and (C) an inorganic filler and has a content ratio of the polyamide resin (A) to the maleic anhydride-modified product of ethylene-octene copolymer (B) is the polyamide resin (A)/the maleic anhydride-modified product of ethylene-octene copolymer (B)=70/30 to 95/5. 【課題】本発明は、良好な熱伝導性、成形加工性を有し、機械強度が良好な成形体を形成できる樹脂組成物および成形体の提供を目的とする。【解決手段】ポリアミド樹脂（Ａ）、エチレン-オクテン共重合体の無水マレイン酸変性物（Ｂ）および無機充填剤（Ｃ）を含む樹脂組成物であり、ポリアミド樹脂（Ａ）とエチレン-オクテン共重合体の無水マレイン酸変性物（Ｂ）の含有量比が、ポリアミド樹脂（Ａ）／エチレン-オクテン共重合体の無水マレイン酸変性物（Ｂ）＝７０／３０〜９５／５である、樹脂組成物により解決される。