CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND METHODS FOR PRODUCING THEM

• Main Authors: NISHIYA YOSHINORI, KAMEYAMA ATSUSHI, UENO RYUICHI
• Format: Patent
• Language: English; Japanese
• Published: 22.03.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a curable composition for obtaining a cured product having high heat resistance, a cured product thereof, and methods for producing the curable composition and the cured product.SOLUTION: There are provided: a curable composition containing (A) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (B) a phenolic curing agent, (C) a curing accelerator, and optionally (D) an epoxy compound other than (A), (E) an inorganic filler, and (F) a silane coupling agent; a cured product of the curable composition; and methods for producing the curable composition and the cured product.SELECTED DRAWING: None 【課題】高耐熱性を有する硬化物を得るための硬化性組成物、その硬化物、ならびに該硬化性組成物および該硬化物の製造方法を提供する。【解決手段】（Ａ）ノルボルナン構造を少なくとも一つ、およびエポキシ基を少なくとも二つ有するエポキシ化合物、（Ｂ）フェノール系硬化剤、（Ｃ）硬化促進剤、および任意に（Ｄ）該（Ａ）以外のエポキシ化合物、（Ｅ）無機充填剤、（Ｆ）シランカップリング剤を含有する硬化性組成物、その硬化物、ならびに該硬化性組成物および該硬化物の製造方法とする。【選択図】なし