COMPOSITE ELECTRONIC COMPONENT AND MOUNTING BOARD THEREOF
To provide a composite electronic component capable of efficiently reducing acoustic noise, and a mounting board thereof.SOLUTION: A composite electronic component of the present invention includes a composite body 300 in which a multilayer ceramic capacitor 100 and a ceramic chip 200 disposed on a...
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Main Authors | , , , , |
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Format | Patent |
Language | English Japanese |
Published |
14.03.2019
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a composite electronic component capable of efficiently reducing acoustic noise, and a mounting board thereof.SOLUTION: A composite electronic component of the present invention includes a composite body 300 in which a multilayer ceramic capacitor 100 and a ceramic chip 200 disposed on a lower portion of the multilayer ceramic capacitor are coupled to each other, the multilayer ceramic capacitor including: a body 110 which includes a plurality of dielectric layers 111 and in which internal electrodes 121 and 122 disposed to face each other with respective dielectric layers interposed therebetween are stacked; and first and second external electrodes 131 and 132 disposed on both end portions of the body. The ceramic chip has a double-step shape formed by coupling ceramic chips 200a and 200b having different lengths to each other in a vertical direction.SELECTED DRAWING: Figure 2
【課題】アコースティックノイズを効率的に低減させることができる複合電子部品及びその実装基板を提供する。【解決手段】本発明の複合電子部品は、複数の誘電体層111を有し、誘電体層を間に挟んで互いに対向するように配置される内部電極121、122が積層された本体110及び本体の両端部に配置された第1及び第2外部電極131、132を含む積層セラミックキャパシタ100と、積層セラミックキャパシタの下部に配置されたセラミックチップ200と、が結合した複合体300を含む。セラミックチップは、長さが異なる2つのセラミックチップ200aと200bが上下に結合した2段形状を有する。【選択図】図2 |
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Bibliography: | Application Number: JP20180106679 |