CLAD ARTICLE AND METHOD FOR FORMING CLAD ARTICLE

• Main Authors: TOLLISON BRIAN LEE, SRIKANTH CHANDRUDU KOTTILINGAM, CUI YAN
• Format: Patent
• Language: English; Japanese
• Published: 07.03.2019
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; AIR INTAKES FOR JET-PROPULSION PLANTS; ALLOYS; BLASTING; CASTING; CHEMISTRY; COMBUSTION ENGINES; CONTROLLING FUEL SUPPLY IN AIR-BREATHING JET-PROPULSION PLANTS; ENGINE PLANTS IN GENERAL; FERROUS OR NON-FERROUS ALLOYS; GAS-TURBINE PLANTS; HEATING; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS; LIGHTING; MACHINES OR ENGINES IN GENERAL; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MECHANICAL ENGINEERING; METALLURGY; NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAMTURBINES; PERFORMING OPERATIONS; POWDER METALLURGY; STEAM ENGINES; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WEAPONS; WORKING METALLIC POWDER

To provide a clad article (200) including an article (100) and a cladding layer (202).SOLUTION: The article (100) includes a surface layer (102), a cavity (104) disposed within the article (100) below the surface layer (102), and a microcrack (106) disposed in the surface layer (102). The surface layer (102) includes an HTW alloy (108). The cladding layer (202) is disposed on a surface (110) of the surface layer (102), and is formed from a PSP (204) brazed to the article (100). The cladding layer (202) is disposed over the microcrack (106). A method for forming the clad article (200) is disclosed including disposing the PSP (204) on the article (100) and brazing the PSP (204) to the article (100). Brazing the PSP (204) to the article (100) forms the cladding layer (202) disposed on the article (100) over the microcrack (106).SELECTED DRAWING: Figure 2 【課題】物品（１００）およびクラッド層（２０２）を含むクラッド物品（２００）が開示される。【解決手段】物品（１００）は、表面層（１０２）と、表面層（１０２）の下の物品（１００）内に配置されたキャビティ（１０４）と、表面層（１０２）内に配置されたマイクロクラック（１０６）とを含む。表面層（１０２）は、ＨＴＷ合金（１０８）を含む。クラッド層（２０２）は、表面層（１０２）の表面（１１０）上に配置され、物品（１００）にろう付けされたＰＳＰ（２０４）から形成される。クラッド層（２０２）は、マイクロクラック（１０６）の上に配置される。物品（１００）上にＰＳＰ（２０４）を配置し、物品（１００）にＰＳＰ（２０４）をろう付けすることを含むクラッド物品（２００）の形成方法が開示される。物品（１００）にＰＳＰ（２０４）をろう付けすることによって、物品（１００）上に配置されたクラッド層（２０２）をマイクロクラック（１０６）の上に形成する。【選択図】図２