CERAMIC CIRCUIT BOARD

To provide a ceramic circuit board capable of suppressing warping of a base plate as well as maintaining high adhesiveness of a ceramic base material and a metal layer even by repeated heat generation and cooling.SOLUTION: A ceramic circuit board includes a ceramic base material 1 and at least one o...

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Bibliographic Details
Main Authors SAKAI ATSUSHI, HIROTSURU HIDEKI, ICHIKAWA KOKI, TANIGUCHI YOSHITAKA
Format Patent
LanguageEnglish
Japanese
Published 28.02.2019
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONDUCTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
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Summary:To provide a ceramic circuit board capable of suppressing warping of a base plate as well as maintaining high adhesiveness of a ceramic base material and a metal layer even by repeated heat generation and cooling.SOLUTION: A ceramic circuit board includes a ceramic base material 1 and at least one of metal layers 2a and 2b respective provided on the sides of the ceramic base material 1 and containing Al and/or Cu, and at least one of the metal layers 2a and 2b forms a metal circuit, and the ultra-fine load hardness of the outermost layer of the metal layers 2a and 2b is 70 or more.SELECTED DRAWING: Figure 1 【課題】ベース板の反りを抑制できるのみならず、繰り返し行われる発熱及び冷却によってもセラミックス基材及び金属層の高い密着性を維持できるセラミックス回路基板を提供すること。【解決手段】セラミックス基材１と、セラミックス基材１の両面のそれぞれに設けられ、Ａｌ及び／又はＣｕを含む少なくとも一層の金属層２ａ，２ｂと、を備え、金属層２ａ，２ｂのうちの少なくとも一方が金属回路を形成しており、金属層２ａ，２ｂの最外層の超微小負荷硬さが７０以上である、セラミックス回路基板。【選択図】図１
Bibliography:Application Number: JP20170151892