METHOD FOR SEPARATING AND RECOVERING METAL IN PLATING MEDIUM ABD METHOD FOR RECYCLING PLATING MEDIUM

To provide a method for separating and recovering metal from a plating medium capable of separating and recovering various metals from a metal mixture with high accuracy and further reducing the waste which is difficult to process, and to provide a method for recycling the plating medium.SOLUTION: A...

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Bibliographic Details
Main Author NAKAMURA HIDEMI
Format Patent
LanguageEnglish
Japanese
Published 21.02.2019
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Summary:To provide a method for separating and recovering metal from a plating medium capable of separating and recovering various metals from a metal mixture with high accuracy and further reducing the waste which is difficult to process, and to provide a method for recycling the plating medium.SOLUTION: A core and a metal surface layer are dissociated in a used plating medium, and the metal surface layer is dissolved with an acid to obtain a metal mixed aqueous solution 13 containing Ni ions 9 and Sn ions 11. The metal mixed aqueous solution 13 is passed through a column 17 filled with an anion exchange fiber 15, whereby the Sn ions 11 are selectively adsorbed to the anion exchange fiber 15. The Sn ion 11 is thus separated from the metal mixed aqueous solution 13, and an Ni ion aqueous solution 19 containing only the Ni ions 9 can be recovered. Since the Sn ions 11 can be desorbed and recovered from the anion exchange fiber 15 by flowing water as an eluent, Ni and Sn can be separated and recovered from the plating medium with high accuracy using a small amount of acid and water.SELECTED DRAWING: Figure 4 【課題】金属混合物から各種金属を高い精度で分離回収できるとともに、処理が困難な廃液の発生をより低減できるめっきメディアから金属を分離回収する方法、およびめっきメディアのリサイクル方法を提供する。【解決手段】使用済み状態のめっきメディアに対してコアと金属表層を解離させ、金属表層を酸で溶解することによってNiイオン9とSnイオン11とを含む金属混合水溶液13を取得する。陰イオン交換繊維15が充填されたカラム17へ金属混合水溶液13を通液することにより、Snイオン11が選択的に陰イオン交換繊維15へ吸着される。その結果、金属混合水溶液13からSnイオン11が分離され、Niイオン9のみを含むNiイオン水溶液19を回収できる。Snイオン11は水を溶離液として通液することにより陰イオン交換繊維15から脱着回収できるので、少量の酸と水によってNiおよびSnをめっきメディアから高精度で分離回収できる。【選択図】図4
Bibliography:Application Number: JP20180051023