SUBSTRATE PROCESSING METHOD

• Main Authors: ENOMOTO MASASHI, NAKAMURA YASUYUKI, KAWAKAMI SHINICHIRO, MIZUNOURA HIROSHI, YOSHIHARA KOSUKE
• Format: Patent
• Language: English; Japanese
• Published: 14.02.2019
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

To form a coating film so that a peripheral end face and a rear side peripheral edge portion which are a peripheral edge section of a substrate is not brought into contact with the coating film when forming the coating film on the surface of the substrate.SOLUTION: A step for forming a protection film on at least a peripheral end face and a rear side peripheral edge portion which are a peripheral edge section of a substrate, a step for forming a coating film on the whole surface of the substrate and a step for removing the protection film from the substrate are successively performed. Consequently the coating film can be formed on the surface of the substrate so that the peripheral end face and the rear side peripheral edge portion of the substrate are not brought into contact with the coating film.SELECTED DRAWING: Figure 13 【課題】基板の表面に塗布膜を形成するにあたり、基板の周縁部である周端面及び裏面側周縁部が塗布膜と接触しないように、当該塗布膜を形成すること。【解決手段】基板の周縁部であって、少なくとも基板の周端面及び裏面側周縁部に保護膜を形成する工程と、次いで、基板の表面全体に塗布膜を形成する工程と、その後、前記保護膜を前記基板から除去する工程と、を行う。それによって基板の周端面及び裏面側周縁部が塗布膜と接触しないように、当該基板の表面に塗布膜を形成することができる。【選択図】図１３