MOVEABLE EDGE COUPLING RING FOR EDGE PROCESS CONTROL DURING SEMICONDUCTOR WAFER PROCESSING

To provide a method for replacing an edge coupling ring without opening a processing chamber.SOLUTION: A substrate processing system comprises: a processing chamber; and a pedestal 20 arranged in the processing chamber. An edge coupling ring 60 is arranged adjacent to the pedestal and around a radia...

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Bibliographic Details
Main Authors JON MACCHESNEY, ROBERT GRIFFITH O'NEILL, YAN HAOQUAN, ALEX PATERSON, RAPHAEL CASAES
Format Patent
LanguageEnglish
Japanese
Published 14.02.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a method for replacing an edge coupling ring without opening a processing chamber.SOLUTION: A substrate processing system comprises: a processing chamber; and a pedestal 20 arranged in the processing chamber. An edge coupling ring 60 is arranged adjacent to the pedestal and around a radially outer edge of the pedestal. A first actuator 80 is configured to form a gap between the edge coupling ring and the pedestal so that the edge coupling ring selectively moves to a raised position with respect to the pedestal and a robotic arm can remove the edge coupling ring from the processing chamber.SELECTED DRAWING: Figure 3 【課題】処理チャンバを開放せずにエッジ連結リングを交換する方法を提供する。【解決手段】基板処理システムは、処理チャンバと、処理チャンバに配置されている台座２０とを備える。エッジ連結リング６０は、台座の半径方向外縁部に隣接して配置される。第１のアクチュエータ８０は、エッジ連結リングを台座に対して上昇位置に選択的に移動し、ロボットアームがエッジ連結リングを処理チャンバから取り除くことができるように、エッジ連結リングと台座との間に隙間を設けるように構成されている。【選択図】図３
Bibliography:Application Number: JP20180186353