DEFLECTED PULSE CMP GROOVE PATTERN
To provide a polishing pad that is suitable for enhancing a removal speed, reducing a used amount of a slurry, improving the overall uniformity, and reducing defects, during chemical mechanical polishing.SOLUTION: A polishing pad includes a radial supply groove which divides the polishing layer into...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English Japanese |
Published |
14.02.2019
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!