DEFLECTED PULSE CMP GROOVE PATTERN

• Main Authors: JOHN VU NGUYEN, JEFFREY ROBERT STACK, JEFFREY JAMES HENDRON, TONY QUAN TRAN
• Format: Patent
• Language: English; Japanese
• Published: 14.02.2019
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a polishing pad that is suitable for enhancing a removal speed, reducing a used amount of a slurry, improving the overall uniformity, and reducing defects, during chemical mechanical polishing.SOLUTION: A polishing pad includes a radial supply groove which divides the polishing layer into polishing regions in the polishing layer. The radial supply groove extends to at least a position in the vicinity of an outer edge part from a position in the vicinity of the center of the polishing pad. Each of the polishing regions includes a series of deflected groove structures connecting two adjacent radial supply grooves. A major part of the deflected grooves has either deflection to the inside toward the vicinity of the center of the polishing pad or deflection to the outside for directing a polishing fluid toward the outer edge part of the polishing pad.SELECTED DRAWING: None 【課題】ケミカルメカニカル研磨中、除去速度を高め、スラリーの使用量を少なくし、全体的な均一性を改善し、かつ欠陥を減少させるに適している研磨パッドを提供する。【解決手段】研磨層内に研磨層を研磨領域に分離している放射状供給溝を含む。放射状供給溝は、少なくとも、研磨パッドの中心近傍の位置から外縁部近傍の位置まで延在している。各研磨領域は、２つの隣接する放射状供給溝を接続する一連の偏倚された溝構造を含んでいる。偏倚された溝の大部分は、研磨パッドの中心近傍の方への内側への偏倚、又は研磨パッドの外縁部の方へ研磨流体を向けるための外側への偏倚のいずれかを有している。【選択図】なし