LIGHT EMITTING DEVICE PACKAGE

To provide a semiconductor device package improving the light extraction efficiency and electrical characteristics and improving the process efficiency.SOLUTION: An embodiment includes: a body 110 including first and second openings TH1, TH2 passing through upper and lower surfaces of the body; a li...

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Bibliographic Details
Main Authors SONG JUNE O, LIM CHANG MAN, LEE TAE SUNG
Format Patent
LanguageEnglish
Japanese
Published 07.02.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a semiconductor device package improving the light extraction efficiency and electrical characteristics and improving the process efficiency.SOLUTION: An embodiment includes: a body 110 including first and second openings TH1, TH2 passing through upper and lower surfaces of the body; a light emitting device 120 disposed on the body and including first and second bonding parts; and first and second conductive layers 321, 322 disposed under the body and electrically connected to the first and second bonding parts, respectively. The first and second bonding parts may include respective protrusion portions protruding and extending downward within the first and second openings.SELECTED DRAWING: Figure 3 【課題】光抽出効率および電気特性を向上し、工程効率を向上させる半導体素子パッケージの提供。【解決手段】上面と下面を貫通する第１及び第２開口部ＴＨ１，ＴＨ２を含む本体１１０と、本体の上に配置され、第１及び第２ボンディング部を含む発光素子１２０と、本体の下に配置され、第１及び第２ボンディング部とそれぞれ電気的に連結された第１及び第２導電層３２１，３２２とを含み、第１及び第２ボンディング部は、第１及び第２開口部内から下部方向に延長されて突出した突出部をそれぞれ含むことができる。【選択図】図３
Bibliography:Application Number: JP20180131401