POWER DEVICE

To prevent a substrate from being damaged.SOLUTION: A metal layer 15 is provided on a main surface 7a side of a substrate 7. A metal layer 12 is formed on the metal layer 15. On the metal layer 12, a solder layer Sd1 is provided. An insulating member X10 is so configured that an end portion 15e of t...

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Bibliographic Details
Main Author TAKAHASHI TETSUO
Format Patent
LanguageEnglish
Japanese
Published 07.02.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To prevent a substrate from being damaged.SOLUTION: A metal layer 15 is provided on a main surface 7a side of a substrate 7. A metal layer 12 is formed on the metal layer 15. On the metal layer 12, a solder layer Sd1 is provided. An insulating member X10 is so configured that an end portion 15e of the metal layer 15 is partially connected to an end portion 12e of the metal layer 12.SELECTED DRAWING: Figure 2 【課題】基板が破損することを抑制する。【解決手段】金属層１５は、基板７の主面７ａ側に設けられている。金属層１２は、金属層１５上に形成されている。金属層１２上には、はんだ層Ｓｄ１が設けられている。金属層１５の端部１５ｅが、金属層１２の端部１２ｅと部分的に接続するように、絶縁部材Ｘ１０は構成されている。【選択図】図２
Bibliography:Application Number: JP20170141692