CUTTING METHOD

• Main Authors: OGIWARA TAKAFUMI, MANABE TOSHIKI, SENOO TAKEHIKO, SOJO TADASHI, IZUMI KOICHI, SAKAMOTO TSUYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 07.02.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a cutting method which enables the increase in the speed of forming a groove along each scheduled cutting line.SOLUTION: A cutting method comprises the steps of: forming a quality-modified region in a target object 1 to be processed; and forming a groove 9 along each scheduled cutting line in the target object 1 to be processed after forming the quality-modified region in the target object 1 to be processed. In the step of forming the groove 9, a first dry etching process is performed from a surface 3 of the target object 1 to be processed toward the backside 4 thereof. After the first dry etching process, a first reduced-pressure process of putting the target object 1 to be processed in an atmosphere of a reduced pressure lower than that in the first dry etching process is performed. After the first reduced-pressure process, a second dry etching process is performed from the surface 3 of the target object 1 to be processed toward the backside 4.SELECTED DRAWING: Figure 13 【課題】切断予定ラインに沿って溝を形成する速度を大きくすることができる切断加工方法を提供する。【解決手段】切断加工方法は、加工対象物１に改質領域を形成する工程と、加工対象物１に改質領域を形成した後に、切断予定ラインに沿って加工対象物１に溝９を形成する工程とを備えている。溝９を形成する工程では、加工対象物１の表面３から裏面４に向かって第１のドライエッチング処理が施される。第１のドライエッチング処理の後に、加工対象物１が第１のドライエッチング処理時よりも減圧の雰囲気下に置かれる第１の減圧処理が施される。第１の減圧処理の後に、加工対象物１の表面３から裏面４に向かって第２のドライエッチング処理が施される。【選択図】図１３