SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE

• Main Authors: AMINO DAIKI, NAKAJI MASAKAZU, EIZAI HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 07.02.2019
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a solder composition having sufficient solder melting property and sufficient storage stability.SOLUTION: A flux composition contains (A) a resin and (B) an activator, where the component (B) contains (B1) an organic acid and (B2) a pyridine compound represented by the following general formula (1), chloride concentration in the solder composition is 900 mass ppm or less, bromine concentration is 900 mass ppm or less and iodine concentration is 900 mass ppm or less, and the total halogen concentration is 1,500 mass ppm or less. In general formula (1), Xto Xare each independently H, a hydroxyl group, a methyl group, an ethyl group or a propyl group, and all of Xto Xare not H.SELECTED DRAWING: None 【課題】十分なはんだ溶融性および十分な保存安定性を有するはんだ組成物を提供する。【解決手段】フラックス組成物が、（Ａ）樹脂と、（Ｂ）活性剤とを含有し、前記（Ｂ）成分が、（Ｂ１）有機酸、および、（Ｂ２）下記一般式（１）で表されるピリジン化合物を含有し、当該はんだ組成物中における塩素濃度が９００質量ｐｐｍ以下であり、臭素濃度が９００質量ｐｐｍ以下であり、ヨウ素濃度が９００質量ｐｐｍ以下であり、かつ、合計のハロゲン濃度が１５００質量ｐｐｍ以下であるものである。（（Ｘ１〜Ｘ３は、夫々独立にＨ、水酸基、メチル基、エチル基又はプロピル基、Ｘ１〜Ｘ３の全てが、Ｈであることはない）【選択図】なし