POLYAMIDE RESIN COMPOSITION REINFORCED WITH INORGANIC FILLER, AND MOLDING THEREOF

• Main Authors: OCHIAI TOSHIHIRO, TERADA KAZUNORI
• Format: Patent
• Language: English; Japanese
• Published: 24.01.2019
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a polyamide resin composition excellent in mechanical strength and appearance.SOLUTION: A polyamide resin composition reinforced with inorganic filler comprises 0 to 150 parts by mass of glass fiber and/or carbon fiber (B) and 10 to 200 parts by mass of non-fibrous inorganic filler (C), relative to 100 parts by mass of a polyamide resin (A); having a ratio of a BET specific surface area Sfrom moisture absorption to a BET specific surface area Sfrom nitrogen gas absorption, i.e., (S/S), of 0.45 or more.SELECTED DRAWING: None 【課題】機械的強度、外観に優れるポリアミド樹脂組成物を提供する。【解決手段】無機充填材強化ポリアミド樹脂組成物を、（Ａ）ポリアミド樹脂１００質量部に対して、（Ｂ）ガラス繊維および／または炭素繊維０〜１５０質量部、（Ｃ）非繊維状無機充填材を１０〜２００質量部含み、（Ｃ）非繊維状無機充填材の水蒸気吸着によるＢＥＴ比表面積Ｓ水蒸気と窒素ガス吸着によるＢＥＴ比表面積Ｓ窒素との比（Ｓ水蒸気／Ｓ窒素）が、０．４５以上であるものとする。【選択図】なし