SEMICONDUCTOR DEVICE

To provide a long-life and high-quality semiconductor device by which a bonding wire to a semiconductor element is appropriately protected, and to provide a method of manufacturing the same.SOLUTION: A semiconductor device comprises: a wiring board having a first pad electrode; a submount substrate...

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Bibliographic Details
Main Author NIHEI NORIKO
Format Patent
LanguageEnglish
Japanese
Published 17.01.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a long-life and high-quality semiconductor device by which a bonding wire to a semiconductor element is appropriately protected, and to provide a method of manufacturing the same.SOLUTION: A semiconductor device comprises: a wiring board having a first pad electrode; a submount substrate that mounts a semiconductor element and has a second pad electrode connected with the semiconductor element; a bonding wire connected between the first pad electrode and the second pad electrode; and a coating resin 30 coating the bonding wire in a sheath shape.SELECTED DRAWING: Figure 2 【課題】半導体素子へのボンディングワイヤが適切に保護され、高寿命かつ高品質な半導体装置及びその製造方法を提供する。【解決手段】第１のパッド電極を有する配線基板と、半導体素子が搭載され、半導体素子に接続された第２のパッド電極を有するサブマウント基板と、第１のパッド電極と第２のパッド電極との間に接続されたボンディングワイヤと、ボンディングワイヤを鞘状に被覆する被覆樹脂３０と、を有する。【選択図】図２
Bibliography:Application Number: JP20170121182