SEMICONDUCTOR DEVICE

To reduce the size of a semiconductor device including an isolator.SOLUTION: Two semiconductor chips CP1 and CP2 constituting a semiconductor device are stacked in a state in which parts of the main surface sides of the semiconductor chips CP1 and CP2 are opposed to each other. Coils CL1 and CL2 res...

Full description

Saved in:
Bibliographic Details
Main Authors NAKASHIBA YASUTAKA, IIDA TETSUYA, KUWABARA SHINICHI
Format Patent
LanguageEnglish
Japanese
Published 17.01.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:To reduce the size of a semiconductor device including an isolator.SOLUTION: Two semiconductor chips CP1 and CP2 constituting a semiconductor device are stacked in a state in which parts of the main surface sides of the semiconductor chips CP1 and CP2 are opposed to each other. Coils CL1 and CL2 respectively formed on the semiconductor chips CP1 and CP2 are arranged so as to be opposed to each other so as to be magnetically coupled during operation of the semiconductor device, and an isolator is constituted by the pair of coils CL1 and CL2. The coils CL1 and CL2 are arranged so as to overlap with a part of circuit regions CAR and CBR of the semiconductor chips CP1 and CP2 in plan view.SELECTED DRAWING: Figure 9 【課題】アイソレータを備える半導体装置を小型化する。【解決手段】半導体装置を構成する２個の半導体チップＣＰ１，ＣＰ２は、その各々の主面側の一部を対向させた状態で積み重ねられている。これら半導体チップＣＰ１，ＣＰ２の各々に形成されたコイルＣＬ１，ＣＬ２は、半導体装置の動作時に磁気結合されるように対向した状態で配置されており、この一対のコイルＣＬ１，ＣＬ２によってアイソレータが形成されている。そして、コイルＣＬ１，ＣＬ２は、半導体チップＣＰ１，ＣＰ２の各々の回路領域ＣＡＲ，ＣＢＲの一部と平面視で重なるように配置されている。【選択図】図９
Bibliography:Application Number: JP20170120798