MOLDING APPARATUS

• Main Authors: ISHII MIKIHIKO, ARAI HIROTO, KONO TAKU, YUHARA KUNIO
• Format: Patent
• Language: English; Japanese
• Published: 17.01.2019
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

To prevent a box-like device from being crushed by resin pressure when resin molding is applied to a substrate provided with the device.SOLUTION: When a resin pressure is applied to an outer peripheral surface of a device 31, an air pressure corresponding to the resin pressure is applied to the inside of the device 31 by a pressurized air supply mechanism 40. For this purpose, the resin pressure is detected by a first pressure sensor 48, the air pressure is detected by a second pressure sensor 49, and a control unit 51 controls a feed valve 44 so that a pressurized air supplied by an air source 42 corresponds to the resin pressure.EFFECT: There is no worry that the device becomes deformed due to resin pressure. The device can be thinned.SELECTED DRAWING: Figure 1 【課題】ボックス状のデバイスを備える基板に樹脂モールドを施すに当たり、デバイスが樹脂圧で潰れないようにする。【解決手段】デバイス３１の外周面に樹脂圧が加わる場合に、加圧空気供給機構４０でデバイス３１内に前記樹脂圧に相当する空気圧を付与する。そのために、第１圧力センサ４８で樹脂圧を検出し、第２圧力センサ４９で空気圧を検出し、空気源４２で供給される加圧空気が樹脂圧に対応するように、制御部５１で給気弁４４を制御する。【効果】デバイスが樹脂圧で変形する心配がない。デバイスを薄肉化できる。【選択図】図１