PACKAGE SUBSTRATE AND MANUFACTURING METHOD OF PACKAGE SUBSTRATE

• Main Authors: KOIDE MASATERU, WATANABE MANABU, FUKUSONO KENJI, HOSHINO YUKI
• Format: Patent
• Language: English; Japanese
• Published: 10.01.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To increase the allowable current value of a current flowing through a solder ball.SOLUTION: A package substrate includes a substrate, multiple rands provided on the substrate, a solder resist provided on the substrate and surrounding the multiple rands, respectively, and multiple groups including two rands out of the multiple rands and a solder ball straddling the solder resist sandwiched between the two rands. Each pitch between a position provided with one rand out of two rands included in one of two adjoining groups out of the multiple groups, and a position provided with one rand out of two rands included in the other of two adjoining groups is larger than the pitch between a position provided with one rand out of the two rands included in each group, and a position provided with the other of the two rands included in each group.SELECTED DRAWING: Figure 4 【課題】半田ボールを流れる電流の許容電流値を増加する。【解決手段】パッケージ基板は、基板と、前記基板上に設けられた複数のランドと、前記基板上に設けられ、前記複数のランドそれぞれを取り囲むソルダレジストと、前記複数のランドのうち２つのランド及び前記２つのランドに挟まれた前記ソルダレジストに跨った状態にある半田ボールを含む、複数の群と、を備え、前記複数の群のうちの隣り合う２つの群の一方に含まれる２つのランドのうち１つのランドが設けられた位置と、前記隣り合う２つの群の他方に含まれる２つのランドのうち１つのランドが設けられた位置と、の間の各ピッチは、前記各群に含まれる前記２つのランドのうちの一方が設けられた位置と、前記各群に含まれる前記２つのランドのうちの他方が設けられた位置と、の間のピッチよりも大きい。【選択図】図４