CURABLE RESIN COMPOSITION, LAMINATE STRUCTURE, CURED PRODUCT OF THE SAME, AND ELECTRONIC COMPONENT

• Main Authors: MIYABE HIDEKAZU, ODAGIRI YUTO, SUMIYA TAKENORI
• Format: Patent
• Language: English; Japanese
• Published: 10.01.2019
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

To provide a curable resin composition satisfying required performance for both a solder resist and a coverlay and has excellent developability (alkali solubility) and heat resistance (solder heat resistance), and to provide a curable resin composition suitable for an insulation film of an electronic component such as a flexible printed wiring board, particularly suitable for a collective formation process of a folded part (bent part) and a mounting part (non-bent part), a laminate structure, and an electronic component such as a flexible printed wiring board having a cured product of the above composition as a protective film such as the coverlay or the solder resist.SOLUTION: A curable resin composition comprises an alkali-soluble polyimide resin, an alkali-soluble resin other than the polyimide resin, core-shell rubber particles, and a curable compound.SELECTED DRAWING: None 【課題】ソルダーレジストおよびカバーレイ双方の要求性能を満足し、現像性（アルカリ溶解性）や耐熱性（はんだ耐熱性）に優れた硬化性樹脂組成物を提供する。また、フレキシブルプリント配線板などの電子部品の絶縁膜、特に折り曲げ部（屈曲部）と実装部（非屈曲部）との一括形成プロセスに適した硬化性樹脂組成物、積層構造体、その硬化物を保護膜、例えば、カバーレイまたはソルダーレジストとして有するフレキシブルプリント配線板などの電子部品を提供する。【解決手段】アルカリ溶解性のポリイミド樹脂と、このポリイミド樹脂以外のアルカリ溶解性の樹脂と、コアシェルゴム粒子と、硬化性化合物とを含有する硬化性樹脂組成物である。【選択図】なし