COPPER ROLLED SHEET AND COMPONENT FOR ELECTRONIC AND ELECTRICAL DEVICE

To provide a copper rolled sheet suitable for components for an electronic and electrical device capable of suppressing generation of defects while excellent in conductivity, strength, flexure processability, and stress relaxation resistance.SOLUTION: A copper rolled sheet contains Mg in a range of...

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Bibliographic Details
Main Authors MATSUNAGA HIROTAKA, MAKI KAZUMASA
Format Patent
LanguageEnglish
Japanese
Published 13.12.2018
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Summary:To provide a copper rolled sheet suitable for components for an electronic and electrical device capable of suppressing generation of defects while excellent in conductivity, strength, flexure processability, and stress relaxation resistance.SOLUTION: A copper rolled sheet contains Mg in a range of 0.005 mass% or more and less than 0.1 mass% and the balance Cu with inevitable impurities, and has H content of less than 2 mass.ppm, P content of less than 20 mass.ppm, O content of less than 10 mass.ppm, S content of less than 20 mass.ppm, a mass ratio of total amount of P, O and S (P+O+S) and Mg amount, (P+O+S)/Mg of 0.6 or less and conductivity of 88%IACS or more.SELECTED DRAWING: None 【課題】導電性、強度、曲げ加工性、耐応力緩和特性に優れるとともに、欠陥の発生を抑制することが可能な電子・電気機器用部品に適した銅圧延板を提供する。【解決手段】Mgを0.005mass%以上0.1mass%未満の範囲で含み、残部がCu及び不可避不純物からなり、Hの含有量が2massppm未満、Pの含有量が20massppm未満、Oの含有量が10massppm未満、Sの含有量が20massppm未満とされ、PとOとSの総量(P+O+S)とMg量との質量比(P+O+S)/Mgが0.6以下とされるとともに、導電率が88%IACS以上とされていることを特徴とする。【選択図】なし
Bibliography:Application Number: JP20180152890