FLUX

• Main Authors: MARUKO DAISUKE, TAKAHASHI ATSUMI, NISHIZAKI TAKAHIRO, KAWASAKI HIROYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 13.12.2018
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a flux which can suppress discoloration and swelling of a protective film formed on a silicon wafer, and can suppress peeling of the protective film from the silicon wafer.SOLUTION: A flux contains 30 mass% or more and less than 100 mass% of a solvent selected from any one of a diglycerol EO additive obtained by addition polymerization of an ethylene oxide with diglycerol, a diglycerol PO additive obtained by addition polymerization of a propylene oxide with diglycerol and a glycerol EO/PO additive obtained by addition polymerization of an ethylene oxide and a propylene oxide with glycerol or a combination of two or more kinds; and more than 0 mass% and 50 mass% or less of an activator.SELECTED DRAWING: None 【課題】シリコンウェハに形成された保護膜の変色、膨潤及び、シリコンウェハからの剥離を抑制することが可能なフラックスを提供する。【解決手段】フラックスは、ジグリセリンにエチレンオキサイドが付加重合されたジグリセリンＥＯ付加物、ジグリセリンにプロピレンオキサイドが付加重合されたジグリセリンＰＯ付加物、グリセリンにエチレンオキサイド及びプロピレンオキサイドが付加重合されたグリセリンＥＯ／ＰＯ付加物の何れか、または、２種以上の組み合わせから選択される溶剤を、３０質量％以上１００質量％未満、活性剤を、０質量％超５０質量％以下で含む。【選択図】無し