LAMINATED, LEAK-RESISTANT CHEMICAL PROCESSORS, METHODS OF MAKING, AND METHODS OF OPERATING

• Main Authors: ANNA LEE TONKOVICH, THOMAS YUSCHAK, ROBERT J LUZENSKI, NEAGLE PAUL W, JENNIFER L MARCO MARCO, JEFFREY D MARCO, SOUMITRA DESHMUKH, MICHAEL A MARCHIANDO, LANE W KEYES
• Format: Patent
• Language: English; Japanese
• Published: 13.12.2018
• Subjects: CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; SOLDERING OR UNSOLDERING; THEIR RELEVANT APPARATUS; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a method of making laminated devices in which plates are assembled and welded together without brazing or diffusion bonding.SOLUTION: A method of making a laminated device comprises: providing a first subassembly and a second subassembly, wherein the first subassembly comprises a first parallel array of channels and wherein the second subassembly comprises a second parallel array of channels and wherein there is no intersection between channels in the first subassembly and the second subassembly; welding an edge of the first subassembly to an edge of the second subassembly to form a combined subassembly layer of welding edges of the first and second subassemblies; and stacking the combined layer with one or more layers, and joining the stacked layers to form a laminated device.SELECTED DRAWING: Figure 2 【課題】プレートが互いに溶接されラミネートされたデバイスを、ろう付け又は拡散接合なしに作製する方法の提供。【解決手段】第１のサブアセンブリ及び第２のサブアセンブリであって、前記第１のサブアセンブリは、チャネルの第１の平行アレイを備え、前記第２のサブアセンブリは、チャネルの第２の平行アレイを備え、前記第１のサブアセンブリと前記第２のサブアセンブリとの間には交差点がないものを提供することと、前記第１のサブアセンブリの端部を、前記第２のサブアセンブリの端部に溶接して、前記第１及び第２のサブアセンブリの溶接端部の組み合わされたサブアセンブリ層を形成し、組み合わされたサブアセンブリ層を形成することと、前記組み合わされた層を１つ以上の層と積層し、前記積層された層を結合してラミネートされたデバイスを形成することと、を含む。【選択図】図２