LAMINATED, LEAK-RESISTANT CHEMICAL PROCESSORS, METHODS OF MAKING, AND METHODS OF OPERATING
To provide a method of making laminated devices in which plates are assembled and welded together without brazing or diffusion bonding.SOLUTION: A method of making a laminated device comprises: providing a first subassembly and a second subassembly, wherein the first subassembly comprises a first pa...
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Main Authors | , , , , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
13.12.2018
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a method of making laminated devices in which plates are assembled and welded together without brazing or diffusion bonding.SOLUTION: A method of making a laminated device comprises: providing a first subassembly and a second subassembly, wherein the first subassembly comprises a first parallel array of channels and wherein the second subassembly comprises a second parallel array of channels and wherein there is no intersection between channels in the first subassembly and the second subassembly; welding an edge of the first subassembly to an edge of the second subassembly to form a combined subassembly layer of welding edges of the first and second subassemblies; and stacking the combined layer with one or more layers, and joining the stacked layers to form a laminated device.SELECTED DRAWING: Figure 2
【課題】プレートが互いに溶接されラミネートされたデバイスを、ろう付け又は拡散接合なしに作製する方法の提供。【解決手段】第1のサブアセンブリ及び第2のサブアセンブリであって、前記第1のサブアセンブリは、チャネルの第1の平行アレイを備え、前記第2のサブアセンブリは、チャネルの第2の平行アレイを備え、前記第1のサブアセンブリと前記第2のサブアセンブリとの間には交差点がないものを提供することと、前記第1のサブアセンブリの端部を、前記第2のサブアセンブリの端部に溶接して、前記第1及び第2のサブアセンブリの溶接端部の組み合わされたサブアセンブリ層を形成し、組み合わされたサブアセンブリ層を形成することと、前記組み合わされた層を1つ以上の層と積層し、前記積層された層を結合してラミネートされたデバイスを形成することと、を含む。【選択図】図2 |
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Bibliography: | Application Number: JP20180130196 |